View OQ2536HP_197570.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
OQ2536HP SDH/SONET STM16/OC48 demultiplexer
Product specification File under Integrated Circuits, IC19 1998 Mar 10
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
FEATURES * Normal and loop (test) modes * 1.2 V GTL (Gunning Transceiver Logic) level compatible data and clock outputs (low speed interface) * Differential CML (Current-Mode Logic) data and clock inputs * High input sensitivity (100 mV for the high speed inputs) * Boundary Scan Test (BST) at low speed interface, in accordance with "IEEE Std 1149.1-1990" * Low power dissipation (typically 1.45 W). ORDERING INFORMATION TYPE NUMBER OQ2536HP PACKAGE NAME HLQFP100 DESCRIPTION DESCRIPTION
OQ2536HP
The OQ2536HP is a 32-channel demultiplexer intended for use in STM16/OC48 applications. It demultiplexes a single 2.5 Gbits/s input channel to 32 x 78 Mbits/s output channels. The data and clock outputs on the low speed interface are GTL compatible, while the high speed data and clock inputs are CML compatible.
VERSION SOT470-1
plastic heat-dissipating low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
BLOCK DIAGRAM
handbook, full pagewidth
DIN DINQ CIN CINQ
54 53 56 57
2.5 Gbits/s 1 : 4 DMUX
622 Mbits/s 4
4x 1 : 8 DMUX
(1)
78 Mbits/s
D0 to D31
75 68 69 70 72 71 12 BST LOGIC
ENL TRST TMS TCK TDI TDO CDIV
OQ2536HP
DLOOP DLOOPQ CLOOP CLOOPQ DIOA DIOC 65 66 60 59 32 31
(2)
DIVIDE BY 4 2.5 GHz
622 MHz
DIVIDE BY 8
78 MHz
BAND GAP REFERENCE 2 13, 14, 36, 26, 27, 28, 37, 63, 85, 86 76, 77 5 7 VCC2 11, 38, 39, 62, 88 5 VEE VCC1 BGCAP2 74 34
BAND GAP REFERENCE 1 51 73
29
GND VDD
BGCAP1 REFC
MGK346
(1) See Chapter "Pinning" for D0 to D31 pin numbers. (2) Pins 1, 8, 17, 22, 25, 29, 33, 35, 40 to 50, 52, 55, 58, 61, 64, 67, 78, 82, 91 and 96.
Fig.1 Block diagram.
1998 Mar 10
2
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
PINNING SYMBOL GND D29 D25 D21 D17 D13 D9 GND D5 D1 VEE CDIV VCC2 VCC2 D28 D24 GND D20 D16 D12 D8 GND D4 D0 GND VDD VDD VDD GND i.c. DIOC DIOA GND BGCAP2 GND VCC2 VCC2 VEE VEE GND 1998 Mar 10 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 TYPE(1) S O O O O O O S O O S O S S O O S O O O O S O O S I I I S - A A S A S S S S S S ground 78 Mbits/s data output channel for D29 78 Mbits/s data output channel for D25 78 Mbits/s data output channel for D21 78 Mbits/s data output channel for D17 78 Mbits/s data output channel for D13 78 Mbits/s data output channel for D9 ground 78 Mbits/s data output channel for D5 78 Mbits/s data output channel for D1 supply voltage (-4.5 V) 78 MHz clock output supply voltage (+1.5 V) supply voltage (+1.5 V) 78 Mbits/s data output channel for D28 78 Mbits/s data output channel for D24 ground 78 Mbits/s data output channel for D20 78 Mbits/s data output channel for D16 78 Mbits/s data output channel for D12 78 Mbits/s data output channel for D8 ground 78 Mbits/s data output channel for D4 78 Mbits/s data output channel for D0 ground supply voltage (+3.3 V) supply voltage (+3.3 V) supply voltage (+3.3 V) ground internally connected, to be left open-circuit cathode of temperature diode array anode of temperature diode array ground DESCRIPTION
OQ2536HP
pin for connecting external band gap decoupling capacitor (4 x 1 : 8 DMUX) ground supply voltage (+1.5 V) supply voltage (+1.5 V) supply voltage (-4.5 V) supply voltage (-4.5 V) ground 3
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
SYMBOL GND GND GND GND GND GND GND GND GND GND BGCAP1 GND DINQ DIN GND CIN CINQ GND CLOOPQ CLOOP GND VEE VCC2 GND DLOOP DLOOPQ GND TRST TMS TCK TDO TDI REFC VCC1 ENL VDD VDD GND D31 D27 1998 Mar 10
PIN 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
TYPE(1) S S S S S S S S S S A S I I S I I S I I S S S S I I S I I I O I A S I I I S O O ground ground ground ground ground ground ground ground ground ground
DESCRIPTION
pin for connecting external band gap decoupling capacitor (1 : 4 DMUX) ground inverted data input in normal mode data input in normal mode ground clock input in normal mode inverted clock input in normal mode ground inverted clock input from multiplexer IC OQ2535 (loop mode) clock input from multiplexer IC OQ2535 (loop mode) ground supply voltage (-4.5 V) supply voltage (+1.5 V) ground data input from multiplexer IC OQ2535 (loop mode) inverted data input from multiplexer IC OQ2535 (loop mode) ground test RESET input for BST mode (active LOW) test mode select input for BST test clock input for BST mode serial test data output for BST mode serial test data input for BST mode pin for connecting external reference decoupling capacitor (for standard TTL reference) supply voltage (+5.0 V) loop mode enable input (active LOW) supply voltage (+3.3 V) supply voltage (+3.3 V) ground 78 Mbits/s data output channel for D31 78 Mbits/s data output channel for D27 4
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
SYMBOL D23 GND D19 D15 VCC2 VCC2 D11 VEE D7 D3 GND D30 D26 D22 D18 GND D14 D10 D6 D2 Note
PIN 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
TYPE(1) O S O O S S O S O O S O O O O S O O O O ground
DESCRIPTION 78 Mbits/s data output channel for D23 78 Mbits/s data output channel for D19 78 Mbits/s data output channel for D15 supply voltage (+1.5 V) supply voltage (+1.5 V) 78 Mbits/s data output channel for D11 supply voltage (-4.5 V) 78 Mbits/s data output channel for D7 78 Mbits/s data output channel for D3 ground 78 Mbits/s data output channel for D30 78 Mbits/s data output channel for D26 78 Mbits/s data output channel for D22 78 Mbits/s data output channel for D18 ground 78 Mbits/s data output channel for D14 78 Mbits/s data output channel for D10 78 Mbits/s data output channel for D6 78 Mbits/s data output channel for D2
1. Pin type abbreviations: O = Output, I = Input, S = power Supply, A = Analog function.
1998 Mar 10
5
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
86 VCC2 85 VCC2
78 GND
98 D10
97 D14
95 D18
94 D22
93 D26
92 D30
84 D15
83 D19
100 D2
GND D29 D25 D21 D17 D13 D9 GND D5
1 2 3 4 5 6 7 8 9
81 D23
99 D6
90 D3
89 D7
handbook, full pagewidth
77 VDD 76 VDD 75 ENL 74 VCC1 73 REFC 72 TDI 71 TDO 70 TCK 69 TMS 68 TRST 67 GND 66 DLOOPQ 65 DLOOP 64 GND 63 VCC2 62 VEE 61 GND 60 CLOOP 59 CLOOPQ 58 GND 57 CINQ 56 CIN 55 GND 54 DIN 53 DINQ 52 GND 51 BGCAP1 GND 49 GND 50
96 GND
91 GND
82 GND
88 VEE 87 D11
80 D27 GND 46
D1 10 VEE 11 CDIV 12 VCC2 13 VCC2 14 D28 15 D24 16 GND 17 D20 18 D16 19 D12 20 D8 21 GND 22 D4 23 D0 24 GND 25 VDD 26 VDD 27 VDD 28 GND 29 i.c. 30 DIOC 31 DIOA 32 GND 33 BGCAP2 34 GND 35 VCC2 36 VCC2 37 VEE 38 VEE 39 GND 40 GND 41 GND 42 GND 43 GND 44 GND 45 GND 47 GND 48
OQ2536HP
79 D31
MGK345
Fig.2 Pin configuration.
1998 Mar 10
6
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
FUNCTIONAL DESCRIPTION The OQ2536HP is a 32-channel demultiplexer, intended for use in STM16/OC48 applications. It demultiplexes a single 2.5 Gbits/s input channel to 32 x 78 Mbits/s output channels. The demultiplexing is performed in two stages. The 2.5 Gbits/s data channel is first demultiplexed to four 622 Mbits/s data channels. Each of these channels is then fed to a 1 : 8 demultiplexer to generate 32 x 78 Mbits/s output channels. The ENL control input is used for switching between normal and loop modes. When loop mode is enabled (ENL = LOW), inputs DLOOP, DLOOPQ, CLOOP and CLOOPQ are selected. In normal mode (ENL = HIGH), inputs DIN, DINQ, CIN and CINQ are selected. The signal applied to CIN and CINQ is a 2.5 GHz recovered clock signal, e.g. coming from the OQ2541 data and clock recovery IC. The clock is divided down to 78 MHz, which is used for receive logic timing and is available as a GTL compatible output at pin CDIV. High bit rate stage: 1 : 4 DMUX The 2.5 Gbits/s data stream is fed into a 1 : 4 demultiplexer to generate four 622 Mbits/s channels. The input pins DIN, DINQ, DLOOP, DLOOPQ, CIN, CINQ, CLOOP and CLOOPQ are terminated internally with 50 resistors to GND. Low bit rate part: 4 x 1 : 8 DMUX The four 622 Mbits/s output channels coming from the high bit rate stage are loaded into four 8-bit shift registers. The 622 MHz clock for these shift registers comes from the preceding stage. The 32 bits contained in the shift registers are loaded into latches and made available on outputs D0 to D31. These outputs are 1.2 V GTL compatible and have internal 100 pull up resistors. The 78 MHz clock output, CDIV, has an internal 50 pull up resistor. The first serial data bit coming in at DIN or DLOOP is given out at pin D31 (MSB) and so on. The data outputs may not always represent four STM bytes. This is because the internal load pulse for the output latches is not synchronized to the STM16 frame. Power supply connections The power supply pins need to be individually decoupled using chip capacitors mounted as close as possible to the 1998 Mar 10 7
OQ2536HP
IC. If multiple decoupling capacitors are used for a single supply node, large distance between the capacitances should be avoided in order to avoid resonance. To minimize low frequency switching noise in the vicinity of the OQ2536HP, all power supply lines should be filtered once by an LC-circuit with a low cutoff frequency (as shown in the application diagram, Fig.7). Ground connection The ground connection on the PCB needs to be a large copper area fill connected to a common ground plane with low inductance. RF connections A coupled stripline or microstrip with an odd mode characteristic impedance of 50 (nominal value) should be used for the RF connections on the PCB. The connections should be kept as short as possible. This applies to the CML differential line pairs CIN and CINQ, DIN and DINQ, CLOOP and CLOOPQ, and DLOOP and DLOOPQ. In addition, the following lines should not vary in length by more than 5 mm: * CIN, CINQ, DIN and DINQ * DLOOP, DLOOPQ, CLOOP and CLOOPQ. Interface to receive logic The 78 Mbits/s interface lines, CDIV and D0 to D31, should not exceed 50 mm in length. The parasitic capacitance of these lines should be as small as possible (less than 3 pF is desirable). ESD protection All pads are protected by ESD protection diodes, with the exception of the high frequency inputs DIN, DINQ, DLOOP, DLOOPQ, CIN, CINQ, CLOOP and CLOOPQ. Cooling In many cases it is necessary to mount a special cooling device on the package. The thermal resistance from junction to case, Rth j-c and from junction to ambient, Rth j-a, are given in Chapter "Thermal characteristics". Since the heat-slug in the package is connected to the die, the cooling device should be electrically isolated. To calculate if a heatsink is necessary, the maximum allowed total thermal resistance R is calculated as: T j - T amb R th = ----------------------(1) P tot
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
where: Rth = total thermal resistance from junction to ambient in the application Tj = junction temperature Tamb = ambient temperature. As long as Rth is greater than Rth j-a of the OQ2536HP including environmental conditions like air flow and board layout, no heatsink is necessary. For example if Tj = 120 C, Tamb = 70 C and Ptot = 1.45 W, then: ( 120 - 70 ) (2) R th = ---------------------------- = 34.4 [ K W] 1.45 which is more than the worst case Rth j-a = 33 K/W, so no heatsink is necessary. Another example; if for safety reasons Tj should stay as low as 110 C, while Tamb = 85 C and Ptot = 2 W, then: ( 110 - 85 ) R th = ---------------------------- = 12.5 (3) [ K W] 2.0 In this case extra cooling is needed. The thermal resistance of the heatsink is calculated as follows:
-1 1 1 R thh - a ------- - ---------------- - R thj - c - R thc - h R th R thj - a
OQ2536HP
If for instance Rth c-h = 0.5 K/W and Rth j -a = 33 K/W then: 1 1 -1 [ K W] R thh - a ---------- - ----- - 3.1 17.0 (5) 12.5 33 Built in temperature sensor Three series-connected diodes have been integrated for measuring junction temperature. The diode array, accessed by means of the DIOA (anode) and DIOC (cathode) pins, has a temperature dependency of approximately -6 mV/C. With a diode current of 1 mA, the voltage will be somewhere in the range 1.7 to 2.5 V, depending on temperature. Boundary Scan Test (BST) interface Boundary scan test logic has been implemented for all digital inputs and outputs on the low frequency interface, in accordance with "IEEE Std 1149.1-1990". All scan tests other than SAMPLE mode are available. The boundary scan test logic consists of a TAP controller, a BYPASS register, a 2-bit instruction register, a 32-bit identification register and a 36-bit boundary scan register (the last two are combined). The architecture of the TAP controller and the BYPASS register is in accordance with IEEE recommendations. The four command modes, selected be means of the instruction register, are: EXTEST (00), PRELOAD (01), IDCODE (10) and BYPASS (11). All boundary scan test inputs, TDI, TMS, TCK and TRST, have internal pull up resistors. The maximum test clock frequency at TCK is 12 MHz.
(4)
where: Rth h-a = thermal resistance from heatsink to ambient Rth c-h = thermal resistance from case to heatsink Rth j-c = thermal resistance from junction to case, see Chapter "Thermal characteristics". Table 1 BST identifier code OQ 01 2536 (BINARY) 00 1001 1110 1000
VERSION 0001 Notes
PHILIPS SEMICONDUCTORS 0000 0011 101(2)
LSB(1) 1
1. LSB is shifted out first on the TDO pin. 2. The manufacturer's code was implemented incorrectly. It should have been 0000 0010 101.
1998 Mar 10
8
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
Table 2 BST bit order SYMBOL D31 D27 D23 D19 D15 D11 D7 D3 D30 D26 D22 D18 D14 D10 D6 D2 D29 D25 D21 D17 D13 D9 D5 D1 CDIV D28 D24 D20 D16 D12 D8 D4 D0 (LSB)(1) ENL PIN 79 80 81 83 84 87 89 90 92 93 94 95 97 98 99 100 2 3 4 5 6 7 9 10 12 15 16 18 19 20 21 23 24 75
OQ2536HP
BIT NUMBER 33 (MSB) 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Note 1. LSB is shifted out first on the TDO pin.
1998 Mar 10
9
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC1 VEE VDD VCC2 Vn supply voltage supply voltage supply voltage supply voltage DC voltage pins 2 to 7, 9, 10, 15, 16, 18 to 21, 23, 24, 79, 80, 81, 83, 84, 87, 89, 0.0 90, 92 to 95 and 97 to 100 pins 53, 54, 56, 57, 59, 60, 65 and 66 pins 68, 69, 70, 72, 73 and 75 pins 30, 34 and 51 pins 31and 32 In DC current pins 2 to 7, 9, 10, 15, 16, 18 to 21, 23, 24, 79, 80, 81, 83, 84, 87, 89, - 90, 92 to 95, and 97 to 100 pin 12 pins 31 and 32 pin 71 Ptot Tj Tstg total power dissipation junction temperature storage temperature - - - - - -65 -1.0 -0.5 VEE - 0.5 VEE - 0.5 PARAMETER MIN. -0.5 -6.0 -0.5 -0.5
OQ2536HP
MAX. +6.0 +0.5 +5.0 +2.0 2.0 +0.5 0.5
UNIT V V V V V V V
VCC1 + 0.5 V VCC1 + 0.5 V 15 30 10 50 2.6 120 +150 mA mA mA mA W C C
THERMAL CHARACTERISTICS SYMBOL Rth j-c Rth j-a PARAMETER thermal resistance from junction to case thermal resistance from junction to ambient see note 1 airflow = 0 ft/min airflow = 100 ft/min airflow = 200 ft/min airflow = 400 ft/min airflow = 600 ft/min Note 1. The thermal resistance from junction to ambient is strongly depending on the board design and airflow. The values given in the table are typical values and are measured on a single sided test board with dimensions of 76 x 114 x 1.6 mm. Better values can be obtained when mounted on multilayer boards with large ground planes. 33 28 25 22 20 K/W K/W K/W K/W K/W CONDITIONS VALUE 2.6 UNIT K/W
1998 Mar 10
10
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
DC CHARACTERISTICS Typical values at Tamb = 25 C and at typical supply voltages; minimum and maximum values are valid over the entire ambient temperature range and supply voltage range. SYMBOL General VCC1 VEE VDD VCC2 ICC1 IEE IDD ICC2 Ptot Tj Tamb VIL VIH IIL IIH VIL VIH supply voltage supply voltage supply voltage supply voltage supply current supply current supply current supply current total power dissipation junction temperature ambient temperature note 1 note 1 4.75 -4.75 3.14 1.1 - - - - - - -40 - 2.0 -90 - 2.0 50 measurement system 5.0 -4.5 3.3 1.5 14 170 100 190 1.45 - - - - - - - - 5.25 -4.25 3.47 1.6 22 215 185 525 2.6 +120 +85 V V V V mA mA mA mA W C C PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
TTL input: ENL LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current 0.8 - 210 V V A A
TTL inputs: TDI, TCK, TMS and TRST; note 2 LOW-level input voltage HIGH-level input voltage 0.4 - V V
CML inputs: CIN, CINQ, DIN, DINQ, CLOOP, CLOOPQ, DLOOP and DLOOPQ; note 3 Vi(p-p) VIO VI,IQ Zi VOL input voltage (peak-to-peak value) permitted input offset voltage input voltages single ended input impedance for DC signal 100 -25 -600 - - 250 - - 50 500 +25 +250 - mV mV mV
TTL output: TDO; note 4 LOW-level output voltage IOL = 4 mA 0.3 0.5 V
1998 Mar 10
11
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
SYMBOL VOH IOZ VOL VOH
PARAMETER HIGH-level output voltage output current in high impedance state
CONDITIONS IOH = -400 A
MIN. 2.4 -
TYP. 4.0 -
MAX. - 1
UNIT V A
Outputs: CDIV and D0 to D31; notes 5 and 6 LOW-level output voltage HIGH-level output voltage; note 7 Open outputs 1.1 - 0.3 1.5 0.4 1.6 - V V
Temperature diode array VDIOA-DIOC diode voltage range(8) Notes 1. Maximum current ICC2 and maximum power dissipation Ptot are worst case figures i.e. data outputs D0 to D31 remain in LOW state. 2. TDI, TCK, TMS and TRST are connected via 90 k to VDD. 3. See Fig.3 for symbol definitions. 4. TDO is switched to high impedance state if BST is inactive. 5. Output CDIV has an internal pull-up resistor of 50 to VCC2. Outputs D0 to D31 have internal pull-up resistors of 100 to VCC2. 6. The first serial data bit coming in at DIN or DLOOP is given out at D31 (MSB) and so on. 7. The HIGH-level output voltage depends on the supply voltage VCC2. 8. The temperature diode array can be used to measure the temperature of the die. The temperature dependency of this voltage is approximately -6 mV/K. II(d) = 1 mA 2.1 V
handbook, full pagewidth
CML INPUT
CML OUTPUT
VI(max) GND VIQH VIH Vi (p-p) VIQL VIL VI(min) VIO VOQL VOL VO(min) VOO VO(max) VOQH VOH Vo (p-p) GND
MGK144
Fig.3 Logic level symbol definitions for CML.
1998 Mar 10
12
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
TIMING Typical values at Tamb = 25 C and at typical supply voltages; minimum and maximum values are valid over the entire ambient temperature range and supply voltage range. SYMBOL PARAMETER CONDITIONS MIN. TYP. - - - - MAX. - - - - - 2700 1000 5100 1000 2700 2850 UNIT
CML input timing; note 1; Fig.5 fclk(CIN) tsu th SRCIN fclk(CDIV) CDIV tr(CDIV) tf(CDIV) tr(D0 to D31) tf(D0 to D31) tCDV tDI Notes 1. The specified timing characteristics are applicable in both normal and loop modes. 2. A capacitive load of 15 pF was connected at all outputs. An input reference level of 1 V was used. input clock frequency input data set-up time input data hold time clock slew rate 2.488 140 80 1 fclk(CDIV) = 2.488 GHz - Measured between 10% and 90% levels of full output swing - - - - - - GHz ps ps V/ns
TTL output timing; note 2; Fig.6 output clock frequency output clock duty factor output clock rise time output clock fall time data out rise time data out fall time clock edge to data valid time data invalid time 77.76 50 - - - - - - MHz % ps ps ps ps ps ps
handbook, halfpage
VCC2 100 D0 to D31
handbook, halfpage
VCC2 50 CDIV
GND
MBK756 MBK757
GND
Fig.4 GTL output circuits.
1998 Mar 10
13
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
OQ2536HP
handbook, full pagewidth
Tcy(CIN)
CIN
50%
DIN
100 mV
MGK347
tsu th
valid data
Fig.5 CML input timing.
handbook, full pagewidth
Tcy(CDIV)
CDIV
1.0 V
1.1 V D0 to D31 0.9 V
tDI tCDV
MGK348
Fig.6 Output timing.
1998 Mar 10
14
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
APPLICATION INFORMATION
OQ2536HP
handbook, full pagewidth
DATA AND CLOCK RECOVERY
OQ2541
D DIN 54 DQ DINQ 53 CL CLQ CINQ 57 51 ENL microcontroller 75 34 73 BGCAP1
CIN 56
VEE 10 nF VEE
BGCAP2 REFC
10 nF
33 nF TDI TCK BOUNDARY SCAN TEST EQUIPMENT TMS TRST TDO 72 70 69 68
(1)
32 31
DIOA DIOC
VCC2
ferrite bead 100 nF ferrite bead 100 nF 1 F
71
OQ2536
74 VCC1
1 F ferrite bead
DLOOP
DLOOP DLOOPQ CLOOP CLOOPQ
(2)
VDD 100 nF VEE 100 nF
65 66 60 59
(4) (3)
1 F ferrite bead 1 F
OQ2535 DLOOPQ MUX CLOOP
CLOOPQ
GND
D0 to D31
12 CDIV
D0 to D31
C78
RECEIVE LOGIC
MGK349
(1) (2) (3) (4)
VCC2 pins 13, 14, 36, 37, 63, 85 and 86 should be connected together, and to the filter network. VDD pins 26, 27, 28, 76 and 77 should be connected together, and to the filter network. VEE pins 11, 38, 39, 62 and 8 should be connected together, and to the filter network. All GND pins (pins 1, 4, 8, 9, 11, 15, 17, 21, 25, 36, 40, 56, 64, 67, 70, 73, 76, 77, 79, 80, 81, 84, 89, 92 to 98 and 100) must be connected directly to the PCB ground plane.
Fig.7 Application diagram.
1998 Mar 10
15
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
PACKAGE OUTLINE HLQFP100: plastic heat-dissipating low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
OQ2536HP
SOT470-1
c
y X A 75 76 51 50 Z E
e J wM bp Lp pin 1 index 100 1 ZD bp D HD wM B vM B 25 vM A 26 detail X L E HE A A2 A1 (A 3)
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.5 1.3 A3 0.25 bp 0.28 0.16 c 0.18 0.12 D (1) 14.1 13.9 E (1) 14.1 13.9 e 0.5 HD HE J(2) L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 7 0o
o
16.25 16.25 10.15 15.75 15.75 9.15
Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Heatsink intrusion 0.0127 maximum. OUTLINE VERSION SOT470-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-01-13
1998 Mar 10
16
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all LQFP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for LQFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
OQ2536HP
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The footprint must be at an angle of 45 to the board direction and must incorporate solder thieves downstream and at the side corners. Even with these conditions, do not consider wave soldering LQFP packages LQFP48 (SOT313-2), LQFP64 (SOT314-2) or LQFP80 (SOT315-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Mar 10
17
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
OQ2536HP
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Mar 10
18
Philips Semiconductors
Product specification
SDH/SONET STM16/OC48 demultiplexer
NOTES
OQ2536HP
1998 Mar 10
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
Internet: http://www.semiconductors.philips.com
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
425102/200/01/pp20
Date of release: 1998 Mar 10
Document order number:
9397 750 01623

▲Up To Search▲

Price & Availability of OQ2536HP

	To Download OQ2536HP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .